Solar container welding temperature

Why is a solar cell interface vulnerable under temperature cycling?

3. Results and discussion

Does thermal cycle affect the thermal reliability of solar cell joints?

To enhance the thermal reliability of solar cell joints in intricate space conditions, this study delved into the influence of thermal cycle on mechanical properties and microstructures of parallel gap resistance welding (PGRW) joints utilizing both silver (Ag) and Ag-plated Kovar foils.

Why do solar cell weld spots remain unaltered?

There is no evidence of melting or degradation at the Au Ag interface throughout the welding process, as depicted in Fig. 7 d–i. Thus, the employed PGRW current density ensures that the multilayer metal thin films in the solar cell weld spots remain unaltered, preventing any reduction in photoelectric performance of the solar cells. Fig. 7.

Why is a solar cell interface vulnerable under temperature cycling?

Such phenomenon makes the joining interface vulnerable under temperature cycling as the interface would withstand alternating compressive and tensile stresses. This cycling thermal stress would finally damage the joint and reduce reliability of entire solar cell array.

Why do spacecraft need a good welding method?

In addition, as the amount of space mission is increasing significantly fast, the long-time joining feature of soldering makes it out of date. Therefore, spacecraft for outer space requires more efficient welding method capable to achieve both strong connection and reliable extreme temperature cycling performance.

How does temperature cycling affect a solar cell?

According to the literatures on the joints made by soldering, temperature cycling has induced thermal stresses and cracks propagating into solar cell, due to the large CTE differences between solder, foil, and solar cell substrate .

Why do solar cell interconnectors fail during space service?

Interface between solar cell and interconnector experiences serious temperature cycling during space service which would further lead to failure. To further improve the interface joining thermal reliability, elucidation of the interface formation and corresponding microstructure evolution during thermal fatigue is necessary.